AUTO WAFER PROBE MACHINE : SUPER650
ㆍWafer Size : MAX 8"
ㆍMAX Probe Card : 200MM
ㆍMES, Wafer Mapping
ㆍWafer Heating : 30~150°C
ㆍImage System : 0.6x/15.2x, 0.9x/14x, 0.3x
ㆍWafer Auto Change
ㆍOverall Accuracy : ≤ ± 1.5um
COIL MOUNT : SUPER262
ㆍUPH : 20000 EA
ㆍMount Accuracy : +/- 15um
ㆍMount Method : Tray to Sheet
SCREEN PRINTER : SUPER430
ㆍSqueeze Auto Leveling
ㆍVision Position Compensation
ㆍPrinting Area : 300 x 200mm
ㆍPrinting Accuracy : +/- 5um
AUTO TUNING MACHINE : SUPER310
ㆍAI TUNING Algorism
ㆍThe program automatically finds the order
of the poles to be tuned and
adjusts the height.
ㆍThe tuning operation is repeated
automatically until the Spec In is reached.
